The Qualcomm Snapdragon 670 chipset specification and features related rumors have been making round since last august. Now, WinFuture has published a report revealing what’s claims to be the legit Snapdragon 670 specification.
Qualcomm Snapdragon 670 Specifications
As per the WinFuture report, the successor of Snapdragon 660 will manufactured using the same 10nm process which is used for the flagship Snapdragon 845 chipset. It is said to feature a big.LITTLE architecture where it will feature a hexacore and a dual core configuration.
The chipset is claimed to feature a six low-end Kyro 300 Silver core clocked at 2.6 GHz and two high-performance Kyro300 Gold cores clocked at 1.7GHz.
Altogether will offer a 32KB L1 cache and a 1MB of L3 cache SoC. The Snapdragon 670 chipset will come with an Adreno 615 which could deliver a clock up to from 430 MHz to 700 MHz. The Snapdragon 670 will be compatible with both UFS 2.1 and eMMC 5.1 flash memory.
The upcoming Snapdragon chipset will boast an advanced ISP which will support dual-camera configuration of up to a 13 MP + 23 MP setup. The chipset will be able to run a WQHD display and with its Snapdragon X2x modem it could clock download speeds of up to 1 Gbps.
Qualcomm Snapdragon 670 Launch Date
Qualcomm hasn’t set any offical launch date as of yet.However, the reports suggest that the chipset could be announced at the MWC 2018.