Huawei announces 7nm Octa-Core Kirin 810 chipset with Mali-G52 GPU and DaVinci NPU

Main Image
  • Like
  • Comment
  • Share

Huawei has launched a new competitive chipset for its midrange and affordable phones. The new Kirin 810 is the successor to the previous generation’s Kirin 710 SoC and it is based on TSMC’s 7nm process, which is first for a mid-range SoC.

Until now, Huawei had to rely upon Kirin 980 SoC for top-rung and in some mid-range phones, while their Kirin 710 was used for low-end phones. With the arrival of this new chip in its arsenal, Huawei can bridge the gap between the Kirin 980 and Kirin 710 SoC. Ergo, Kirin 810 SoC brings a new tier to Huawei chip portfolio.

The architecture includes two ARM Cortex-A76 ‘big’ cores clocked at 2.27GHz and six Little ARM Cortex-A55 cores clocked at 1.88GHz. Huawei claims a staggering 162% performance improvement over the previous generation chipset thanks to ARM Mali-G52 MP6 GPU, which is backed by Kirin Gaming+ technology.

Kirin 810 vs Snapdragon 730

As per Huawei, the Kirin 810’s Geekbench scores outdo the scores from 8nm based Snapdragon 730 SoC. Apparently, there is an 11% jump in case of single-core and a 13% rise in case of multi-cores.

The Kirin 810 with ARM Mali-G52 MP6 GPU shows a similar stride in GFXBench 1080p Manhattan test with 44% improved frame rate over Snapdragon 730 with Adreno 618 GPU and it is 15% better frame rate in GFXBench 1080p T-Rex test.

Another impressive figure is 32,280 points in AI benchmark, which is better than Snapdragon 855 and MediaTek Helio P90. This score is achieved thanks to a new NPU which uses HUAWEI Da Vinci Architecture based on Rubik’s Cube Quantitative Stereo Arithmetic Unit. Neural capabilities would be complemented by Huawei HiAi 2.0.

This new chipset will enhance gaming experience with system-level AI FM scheduling technology, GPU underlying driver upgrades, GPU load optimization, and HD game effects optimization.

ALSO READ: Black Shark 2 Review: Best Gaming Phone in the Budget?

AI Frequency Modulation scheduling technology can learn frame rate, fluency and touch screen input changes in real time, predict mobile phone task load, dynamically sense performance bottlenecks in mobile phone usage, and improve the prediction accuracy compared to traditional prediction methods.

The Kirin 810 is equipped with Always-on Dual SIM Dual VoLTE support. The modem details should surface soon.

The new IVP (Image Vision Processing) + ISP (Image Sensing Processing) would offer flagship image processing capability with an upgraded pixel processing unit, enhanced white balance algorithm, noise reduction in RAW image processing and more. Huawei compared the low-light image processing with the Snapdragon 730’s Spectra 350 ISP and says that its IVP and ISP delivers better details even in low lighting.

ALSO READ: Asus 6Z Review: A Phone That Simply Clicks

The Kirin 810 SoC would ship with the Nova 5, followed by other Huawei and Bova smartphones in the future.

Vasan G.S.Vasan G.S.
An inquisitive mind who spends a big chunk of the day keenly tracking every emerging detail and is responsible for quickly passing on important developments to Smartprix followers. He loves to stay in his bubble scripting his destiny involving amazing technology and people with good character, passion, and brilliance.

Related Articles

ImageExclusive: Samsung Galaxy Z Flip 6 Specs Revealed Ahead of Unveiling at Paris Unpacked

Samsung’s upcoming Galaxy Unpacked is still several weeks away, and leaks about the products launching at the event keep rolling in. The Galaxy Z Flip6 is one of the products launching at the event alongside the Galaxy Z Fold6, Galaxy Watch7, Galaxy Watch Ultra, and Galaxy Ring.Earlier, we revealed the 5K renders of the …

ImageHonor 9X AnTuTu Score revealed ahead of July 23 launch; Confirms Kirin 810

Earlier in the day Honor CEO George Zao confirmed the July 23 launch of their next mid-range phone, Honor 9X. Now AnTuTu has confirmed in Weibo post that the handset will be powered Kirin 810 and scored 237,000 on the benchmarking platform.The Kirin 810 is the first 7nm mid-range chipset that covers the middle …

ImageHonor 9X retail box images shared online before July 23 launch, will ship with Kirin 810 SoC

Honor 9X is set to launch on July 23 and it is confirmed to be powered by the newest Kirin 810 SoC. The rumors suggest an Honor 9X Pro model as well. Besides the details on a few design and internal elements, we now also have a look at the retail box. The Honor 8X …

ImageQualcomm announces Snapdragon 6s Gen 3 Chipset: First Smartphone Revealed

Leading chipmaker Qualcomm has announced the next SoC in the Gen 6 series. Qualcomm Snapdragon 6s Gen 3 SoC has been launched that is fabricated on a 6nm process and is a 5G-enabled chipset. The SoC is expected to power mid-range devices and features Kyro cores and is paired up with Adreno GPU. Motorola G85 …

ImageMediaTek launches Dimensity 7300 and 7300X that supports foldable displays

One of the largest chipmakers MediaTek announced two new chipsets earlier today. Dubbed Dimensity 7300 and Dimensity 7300X, these chipsets are successors to Dimensity 7050 SoC. Both have an octa-core architecture with the D7300X capable of supporting dual displays and foldable phones. Let’s take a deeper dive to understand the latest offerings. MediaTek Dimensity 7300 …

Discuss

Be the first to leave a comment.