Huawei has launched a new competitive chipset for its midrange and affordable phones. The new Kirin 810 is the successor to the previous generation’s Kirin 710 SoC and it is based on TSMC’s 7nm process, which is first for a mid-range SoC.
Until now, Huawei had to rely upon Kirin 980 SoC for top-rung and in some mid-range phones, while their Kirin 710 was used for low-end phones. With the arrival of this new chip in its arsenal, Huawei can bridge the gap between the Kirin 980 and Kirin 710 SoC. Ergo, Kirin 810 SoC brings a new tier to Huawei chip portfolio.
The architecture includes two ARM Cortex-A76 ‘big’ cores clocked at 2.27GHz and six Little ARM Cortex-A55 cores clocked at 1.88GHz. Huawei claims a staggering 162% performance improvement over the previous generation chipset thanks to ARM Mali-G52 MP6 GPU, which is backed by Kirin Gaming+ technology.
Kirin 810 vs Snapdragon 730
As per Huawei, the Kirin 810’s Geekbench scores outdo the scores from 8nm based Snapdragon 730 SoC. Apparently, there is an 11% jump in case of single-core and a 13% rise in case of multi-cores.
The Kirin 810 with ARM Mali-G52 MP6 GPU shows a similar stride in GFXBench 1080p Manhattan test with 44% improved frame rate over Snapdragon 730 with Adreno 618 GPU and it is 15% better frame rate in GFXBench 1080p T-Rex test.
Another impressive figure is 32,280 points in AI benchmark, which is better than Snapdragon 855 and MediaTek Helio P90. This score is achieved thanks to a new NPU which uses HUAWEI Da Vinci Architecture based on Rubik’s Cube Quantitative Stereo Arithmetic Unit. Neural capabilities would be complemented by Huawei HiAi 2.0.
This new chipset will enhance gaming experience with system-level AI FM scheduling technology, GPU underlying driver upgrades, GPU load optimization, and HD game effects optimization.
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AI Frequency Modulation scheduling technology can learn frame rate, fluency and touch screen input changes in real time, predict mobile phone task load, dynamically sense performance bottlenecks in mobile phone usage, and improve the prediction accuracy compared to traditional prediction methods.
The Kirin 810 is equipped with Always-on Dual SIM Dual VoLTE support. The modem details should surface soon.
The new IVP (Image Vision Processing) + ISP (Image Sensing Processing) would offer flagship image processing capability with an upgraded pixel processing unit, enhanced white balance algorithm, noise reduction in RAW image processing and more. Huawei compared the low-light image processing with the Snapdragon 730’s Spectra 350 ISP and says that its IVP and ISP delivers better details even in low lighting.
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The Kirin 810 SoC would ship with the Nova 5, followed by other Huawei and Bova smartphones in the future.
