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Ulefone Armor 2 With An Extremely Rugged Casing And Helio P25 Coming To MWC 2017

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Ulefone is set to launch a “comprehensive upgrade” to its extremely rugged Armor smartphone, dubbed as the Armor 2, at MWC 2017. Interestingly, beneath its dust and water resistant protective outer shell you will find the latest Helio P25 SoC which is a 16nm process based chipset designed to provide exceptional battery backup.

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The 2.5GHz octa-core chip will be paired with 6GB RAM to ensure that that overall performance isn’t compromised. The impressive looking industrial design frame of Ulefone Armor 2 is made using a combination of metal and plastic. There are 6 hardware keys on the phone, including the front home button which in all likelihood also integrates a biometric fingerprint reader.

We think it’s safe to assume that like its predecessor, this one too will be fit to under extreme temperature conditions, will have a dedicated SOS key and a touch that can be operated with gloves and under water. These features were all there in the first generation Ulefone Armor. From the renders, we can also see that there are no navigation keys flanking the home button this time around.

Also Read: 16nm FinFET Based MediaTek Helio P25 With LPDDR4X Memory Support Goes Official

So, the bottom line is, besides being extremely durable the new Ulefone Armor phone will also pack an improved design and better performance hardware. Of course, Ulefone doesn’t want to reveal the complete picture ahead of the official launch that is scheduled for February 27.

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