Qualcomm interested in buying stakes in Arm: Report

Main Image
  • Like
  • Comment
  • Share

The US chipmaker Qualcomm has shown its interest in buying a stake in Arm along with its rivals to create a consortium that would maintain the chipmaker’s neutrality in the competitive semiconductor market.

The reason behind it is Soft Bank’s move to list Arm on the New York Stock Exchange after Nvidia’s 66 billion dollar purchase collapsed earlier this year. This raised a concern about the future ownership of Arm as it has a very important role to play in the global technology sector.

“We are an interested party in investing. It’s a very important asset and it’s an asset which is going to be essential to the development of our industry,” Christiano Amon, Qualcomm’s Chief Executive said. He believes that since Qualcomm is Arm’s one of the biggest customers, it can join the other chipmakers to buy Arm outright in the consortium is adequate.

ALSO READ: First Batch Of Titles For Xbox Game Pass June 2022 Revealed

ALSO READ: Moto E32s launched in India with 90Hz display and Helio G37 at Rs 8,999

Amon’s idea is that they can get around regulatory hurdles if many companies become a part of this consortium. “You would need to have many companies participating so they have a net effect that ARM is independent.” He feels the potential purchase price will be high enough and thus Qualcomm might strike a deal with the other members that was big enough.

Intel’s CEO also floated the same idea of putting together a consortium to acquire Arm. He also met with Samsung Group about the proposal. Whether a deal of this level will materialize or not remains to be seen, but it is a possibility.

A consortium made of Arm’s biggest customers would definitely ease the concerns the regulators may have, allowing the deal to finalize. However, if the deal has to be considered seriously, then Samsung will have to be a part of this discussion.

Shivangi AgarwalShivangi Agarwal
Shivangi is an honours graduate in English from Delhi University with a passion for reading and writing. Always keen to know more about the latest gadgets, when she is not reading about tech, she loves listening to Hindi music and grooving to the latest Hindi beats.

Related Articles

ImageExclusive: Samsung Galaxy Z Fold 6 Full Specs Revealed Weeks Before Paris Unpacked

Next month, Samsung is set to host its second Unpacked event of the year, this time in Paris, France. At this upcoming event, Samsung will make several big announcements. While the Galaxy Ring will be the showstopper, we are all waiting for details regarding the Galaxy Z Fold6. Earlier this year, we shared the very …

ImageUS permits the sale of chips to Huawei for non-5G business: Report

A sliver of hope for Huawei as the US administration has reportedly allowed a number of American chip manufacturers to sell silicon to the Chinese giant. But the catch is that the company should not use the components for its 5G business. The US Dept. of Commerce has been telling local chipmakers “that while licenses …

ImageMediaTek unveils Dimensity 9000 SoC for premium Android smartphones

MediaTek has launched Dimensity 9000 Chipset which the company plans to offer for premium smartphones, thus coming in direct competition with Qualcomm which currently dominates this field. The Taiwan-based company claims that Dimensity 9000 will be the world’s first chipset to use its manufacturing partner ‘Taiwan Semiconductor Manufacturing Co’s “N4” chipmaking process, which has made …

ImageQualcomm To Expand Windows On Arm Portfolio As New Devices Arrive Later This Year

Traditionally, Microsoft has worked with chip manufacturers like Intel and AMD to leverage the x86 chips and their power. Whether in the affordable, entry-level segment or the performance/flagship tier, hundreds of Intel- or AMD-based machines run the Windows operating system. However, with the advent of system-on-chips like Apple’s M family of processors, companies have begun …

ImageSamsung Eyes Exynos 2500 And Qualcomm’s Return With FOWLP: Report

Samsung Electronics is about to adopt a new processor packaging technique for its high-spec Exynos processors to power the flagship Galaxy S series. According to a report by Hankooki.com, the Korean tech giant is turning toward Fan-Out Wafer-Level Packaging technology for the Exynos 2500 SoC on the Galaxy S25 series. The move aims to enhance …


Be the first to leave a comment.