Sony’s forthcoming smartphone could rock Qualcomm’s new and recently launched Snapdragon 845 processor. The handset was spotted in a leak, which stated Xperia’s new model as H8216 and confirmed the said chipset.

For those unaware, Qualcomm – the largest mobile chipset maker – had announced the successor of Snapdragon 835, earlier this month. The new Snapdragon 845 packs Kryo 385 processor cores clocked at 2.8 GHz and four efficiency cores clocked at 1.8 GHz. The processor is meant to improve the content creation, virtual reality, artificial intelligence, wireless connectivity, and power consumption.

Also Read: Upcoming Sony Xperia Smartphone Will Sport Bezel-less Display

Sony Xperia XZ2 Features (Expected)

The leak didn’t reveal what Sony will be naming the device, but it is presumed to be the Xperia XZ2. And, if the reports are true, then this could be the third smartphone after Samsung Galaxy S9s and Xiaomi Mi 7 with 845 SoC.

Other than the latest processor, the Xperia XZ2 will come equipped with 4GB RAM and 64GB onboard storage, according to the leaks. The phone will have a dedicated support for microSD card.

Also Read: Upcoming Xiaomi Mi 7 To Sport Snapdragon 845 SoC: Confirmed

For photography, the XZ2 is expected to sports a duo of 12-megapixel on the rear and a 15-megapixel sensor with f/2.0 aperture up front. Out of the box, the handset will run the latest Android 8.1 Oreo with Sony’s custom skin employed on top. The phone is likely to house 3,130mAh battery, which will also support Quick Charge.

Design-wise, the Xperia XZ2 comes clad in Sony’s popular ‘blocky’ design with the IP65/68 rating, just like its predecessor. The fascia will have the broad bezels and in between, there is going to be a 5.48-inch Full HD HDR Triluminos display with X-Reality image processing.

In the increasing 18:9 display market, it is interesting to see Sony sticking to the conventional 16:9 display ratio on its 2018 device. Sony H8216 is expected to launch at the CES 2018 or MWC.

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