Since major smartphone manufacturers have started removing the headphone jack from their premium phones, truly wireless earbuds have become quite popular. Manufacturers are putting a lot of effort into improving the two crucial concerns- audio quality and battery durability of such wireless buds. Samsung and Qualcomm, two of the market leaders when it comes to TWS components, have unveiled new chips that will help improve audio quality and battery life.

New Samsung Chip for TWS Earbuds

Samsung has announced its newly developed Power Management Integrated Circuits (PMIC). “TWS earbuds present elevated listening experiences for more users and the trend is rapidly expanding the mobile accessory market, creating new opportunities for device manufacturers,” said a senior vice president of System LSI marketing at Samsung Electronics. “Samsung’s industry-first, all-in-one power management solutions optimized for TWS devices will allow manufacturers to craft new applications with greater flexibility.”

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Samsung’s MUA01 and MUB01 PMICs for charging cases and the earbuds, respectively are to improve the lifetime of TWS devices. The press released by the Korean firm states that Samsung has reduced the space occupied by PMICs compared to previous generation chips by integrating up to ten discrete components into one, including switching chargers and discharge circuits. This compact size helps reduce power consumption and consequently increase battery longevity. The MUA01 supports both wireless and wired charging in a single chip under the Wireless Power Consortium’s (WPC) Qi 1.2.4 standard. 

From Samsung

New Qualcomm Chip for TWS Earbuds

Qualcomm, on the other hand, announced ultra-low-power Bluetooth Systems on a Chip (SoCs). The Qualcomm’s two new chips – QCC514X  (premium tier) and QCC304X ( entry/mid-tier SoCs) are designed to improve robustness and connectivity along with the features enhancing battery life. They have also integrated dedicated hardware to improve noise cancellation and voice assistant support.

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In addition to this, Qualcomm has integrated ANC hardware to enable super-low latency leak-through in the chips. The company promises that these chips will improve the audio quality of TWS devices not only in airplane mode but also in sports and office environments. Qualcomm further stated that the premier tier SoC will offer dedicated support for Always-on Voice (wake-word) activation for multiple voice ecosystems, while the entry tier chip will support push-button voice activation for multiple voice ecosystems.

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