Qualcomm 3D Sonic Fingerprint Technology

Besides unveiling the new Snapdragon 865, 765 and 765G chips, Qualcomm had also announced the 3D Sonic Fingerprint Technology. Evidently, this is an under-display biometric solution. It boasts a bigger field of scanning and two-finger authentication. Even before divulging into the specifics, it might ring as an upgrade over the contemporary solutions.

Ergo, the top brass companies are expected to equip their upcoming phones with it. Currently, the rumored early adopters are Samsung S11 and Apple iPhone 12. However, neither company has officially commented on this.

Nonetheless, let’s understand the new technology and the benefits it is likely to bring about.

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Qualcomm 3D Sonic features

Qualcomm 3D Sonic Fingerprint Technology

For starters, the detection area is 20mm by 30mm which is 17x larger than the precursor which measured 4mm by 9mm.

This upgrade claims to be faster, more secure and easy to use.

From a security standpoint, there is simultaneous two-finger authentication support. The device will unlock only when prints of both the fingers match. We expect this would be optional.

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A larger area facilitates this and has more benefits. A bigger canvas means more space to seat your fingers and thus their readability is going to be better. Qualcomm quotes a – 1 in a million accuracy gain over the current generation’s 1 in 50,000 detection rate.

We might even get to enjoy gesture unlock thanks to the larger recognition area.

All these and the latency would be swift too. As per Katouzian, SVP, and GM, mobile, Qualcomm, scanning will take the same duration as the predecessor.

Interestingly, the use cases might cover automotive, IoT devices, amongst other areas. We hope the company has corrected the issues of the previous version.

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