The recently leaked MediaTek Flagship chipset – Helio X30, has been officially confirmed. However, there is still some time before we get to experience the new smartphone SoC (expected in the second half of the year 2017).
The Helio X30 is manufactured by TSMC and is based on the new 10 nm FinFET process which is expected to drain your battery charge at a much slower pace. Unlike Helio X20 and X25, it utilizes smaller process node that requires less voltage and thus results in low heating and better power efficiency.
Just like the Helio X20 and X25 SoCs, Helio X30 is also a tri-cluster deca-core chip. However, the chipset is distinguished by its cluster design.
The high-performance quad-core cluster meant to do heavy lifting will be clocked at up to 2.8 GHz and the medium quad-core cluster will be clocked at up to 2.2 GHz and the most efficient dual core cluster meant to do light and regular tasks will be clocked at up to 2GHz.
The System-on-Chip will support up to 40MP Camera resolution and up to 24fps of video recording.
With a 16MP sensor, you can record videos at 60fps and at 8MP resolution, you can capture slow-motion footage at 120fps.
The chipset can be allegedly teamed up with a maximum of 8 GB of quad channel, LPDDR4 RAM and a PowerVR-7000 series, quad core GPU. That makes Helio X30 a viable option for upcoming Virtual Reality enabled Smartphones.
According to an analyst-Pan Jiutang, Helio X30 re-Defined the AnTuTu benchmark standard ratings by comfortably beating SnapDragon 820 by a huge margin of 30,000 points.
Also, the Helio X30 includes a Cat 13-LTE modem to boost network performance.
Helio X30 is expected to come fabricated on chipboard of High-end smartphones in the year 2017.