TL; DR
- The Dimensity 7400 gets a tiny 0.1 GHz boost over 7300. 7400X is basically 7400 but optimized for foldables.
- Same GPU, better AI: Mali-G615 MC2 sticks around, APU 655 offers 15% better AI. 7400X supports dual displays.
- First phones expected in April. Razr 60 might use 7400X.
MediaTek dropped its latest mid-range chips, the Dimensity 7400 and 7400X, and they’re pitching them as the next big thing for mid-range phones and foldables. Built on TSMC’s 4nm process, these chips bring modest improvements over their predecessors, though the upgrades may not impress everyone.
A Tiny Bump from the 7300

The Dimensity 7400 is basically the Dimensity 7300 with a 0.1GHz clock speed nudge. And yes, that’s the headline upgrade. It’s a 4nm chip (TSMC) with an octa-core setup: 4X Cortex-A78 cores at 2.6 GHz and 4X Cortex-A55 cores at 2.0 GHz.
The 7400X, meanwhile, is the same deal but tweaked for foldables, offering better power management for dual-screen folables. MediaTek claims up to 36% less power use in gaming compared to “competitors,” though they’re keeping mum on who exactly they’re measuring against.
ALSO READ: Snapdragon 6 Gen 4 vs. Dimensity 6400: The Better Budget King?
What’s New (Sort Of)

Both chips pack the Mali-G615 MC2 GPU, which should handle gaming decently, and they also feature a new APU 655 for AI, which offers 15% better performance than the 7300’s, per MediaTek. The Imagiq 950 ISP is along for the ride, supporting Google Ultra HDR.
The 7400X stands out with dual-display support for flip phones, giving OEMs like Motorola some wiggle room for their foldable designs. Display capabilities top out at WFHD+ at 120 Hz or Full HD+ at 144 Hz, with the 7400X handling dual screens for foldable designs.
Memory support includes LPDDR5 or LPDDR4X up to 6400Mbps, alongside UFS 2.2 or 3.1 storage. Connectivity shines with a 5G R16 modem offering 3CC carrier aggregation (up to 3.27 Gbps downlink), tri-band Wi-Fi 6E, and Bluetooth 5.4.
Launch Timeline

Smartphones with these chips won’t hit shelves until Q1 2025 wraps up, so we’re looking at April at the earliest. No word yet on which brands will bite, but brands like realme, vivo, OPPO, Motorola, and Samsung could adopt them first.
Since the Motorola Razr 50 was the one of the phones (or the only one) to be powered by the Dimensity 7300X, we can expect the Razr 60 to be powered by the Dimensity 7400X, continuing the trend of budget flip phones.
ALSO READ: Qualcomm Launches Snapdragon 7s Gen 3 With 4nm Fabrication Technology And UFS 3.1 Storage
Dimensity 7400/7400X vs. 7300, 7200, and Snapdragon 7s Gen 3
| Dimensity 7400 | Dimensity 7400X | Dimensity 7300 | Dimensity 7200 | Snapdragon 7s Gen 3 | |
| Process | 4nm (TSMC) | 4nm (TSMC) | 4nm (TSMC) | 4nm (TSMC) | 4nm (TSMC) |
| CPU Config | 4x A78 @ 2.6 GHz + 4x A55 @ 2.0 GHz | 4x A78 @ 2.6 GHz + 4x A55 @ 2.0 GHz | 4x A78 @ 2.5 GHz + 4x A55 @ 2.0 GHz | 2x A715 @ 2.8 GHz + 6x A510 @ 2.0 GHz | 1x A720 @ 2.5 GHz + 3x A720 @ 2.4 GHz + 4x A520 @ 1.8 GHz |
| Max Clock Speed | 2.6 GHz | 2.6 GHz | 2.5 GHz | 2.8 GHz | 2.5 GHz |
| GPU | Mali-G615 MC2 | Mali-G615 MC2 | Mali-G615 MC2 | Mali-G610 MC4 | Adreno 710 |
| AI Unit | APU 655 | APU 655 | APU 650 | Unspecified | Hexagon NPU |
| Memory | LPDDR5/4X, UFS 3.1/2.2 | LPDDR5/4X, UFS 3.1/2.2 | LPDDR5/4X, UFS 3.1/2.2 | LPDDR5/4X, UFS 3.1 | LPDDR5, UFS 3.1 |
| Display | WFHD+ @ 120 Hz, FHD+ @ 144 Hz | WFHD+ @ 120 Hz, FHD+ @ 144 Hz (dual) | WFHD+ @ 120 Hz, FHD+ @ 144 Hz | FHD+ @ 144 Hz | FHD+ @ 144 Hz |
| 5G Support | 3.27 Gbps (3CC-CA) | 3.27 Gbps (3CC-CA) | 3.27 Gbps (3CC-CA) | 4.7 Gbps | 2.9 Gbps |
| Connectivity | Wi-Fi 6E, BT 5.4 | Wi-Fi 6E, BT 5.4 | Wi-Fi 6E, BT 5.3 | Wi-Fi 6E, BT 5.3 | Wi-Fi 6E, BT 5.2 |
ALSO READ: List of Phones to Feature the Snapdragon 6 Gen 4 Chipset
The 7400 and 7400X edge out the 7300 by a hair, but the 7200’s higher clock keeps it oddly competitive despite older cores (although we believe that’s discontinued now). Snapdragon 7s Gen 3 pulls ahead with newer ARMv9 architecture and a stronger GPU, though MediaTek’s power efficiency claims might give it a niche edge.
Dr. Yenchi Lee, General Manager of MediaTek’s Wireless Communications Business, emphasized the chips’ balance of “significant performance and impressive energy efficiency” for affordable devices, though the modest “upgrades” might not wow enthusiasts.
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