Chipmaker MediaTek has quietly launched a new chipset in Dimensity 7000 series. MediaTek Dimensity 7050 SoC has been launched, which is a step towards the rebranding of the existing Dimensity 700, 800, and 900 lineups under the new Dimensity 7000 and 6000 series. In terms of specs, MediaTek Dimensity 7050 is a rebranded version of the MediaTek Dimensity 1080 5G chipset.
MediaTek Dimensity 7050: Features
The latest chipset from MediaTek uses TSMC’s advanced 6nm process technology and features a CPU with 2 high-performance 2.6GHz Cortex A78 Cores and 6 power-efficient 2.0GHz Cortex A55 Cores. The chipset comes with a Mali-G68 MC4 GPU and can support LPDDR5/4x memory and UFS 3.1/2.1 storage standards.
The MediaTek Dimensity 7050 chipset can support FHD+ displays with resolutions of up to 2520×1080 pixels and a 120Hz refresh rate. The chipset can handle cameras up to 200MP and support 4K HDR video recording and APU 550 for AI-based camera enhancements.
The Dimensity 7050 comes with encoding support for HEVC and H.264 formats and playback compatibility with HEVC, H.264, MPEG-1/2/4, and VP-9 codecs. In terms of connectivity, it supports dual 5G SIMs, WiFi 6, Bluetooth 5.2, GLONASS, and MediaTek 5G UltraSave power efficiency enhancement suite, among other things.
Realme 11 Series powered by Dimensity 7050 chipset
The newest Dimensity 7050 SoC is expected to power the Realme 11 Series launching in China on May 10. The Realme 11 Pro+ model was seen on Geekbench which confirmed the presence of MediaTek Dimensity 7050 chipset and 12GB RAM.
The Realme 11 Series will include 3 smartphones- Realme 11, Realme 11 Pro, and Realme 11 Pro+. The Realme 11 Pro+ will have a massive circular camera bump at the back along with a lychee leather back design. There is a triple camera setup at the back and the smartphone will come in a Sunrise City color option.
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