Helio P90 With More Powerful APU 2.0 Announced

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As expected, MediaTek today launched their new chipset, Helio P90. The new chipset succeeds and is similar to the Helio P70 that was announced last month and is yet to gain ground. The Helio P90 will only be available in real-world devices later next year.

Helio P90 Features

Touted to be an AI processing powerhouse, Helio P90 is manufactured on the same 12nm process which was used for Helio P70 and P60. What this new chipset brings to the table is the latest APU 2.0 which is expected to run more complex AI apps and functionalities simultaneously with ease.

This new APU (which is MediaTek’s term for NPU) is said to have 4 times more processing power than the previous versions. P90 is an Octa-core processing unit with 2 ARM A75 processors clocked at 2.2 GHz and 6 ARM A55 processors clocked at 2.0 GHz. It also includes an IMG PowerVR GM 9446 GPU for handling the graphics. It also generates super fast 1127GMACs which are claimed to deliver 4.6 times better performance than the earlier P60 or P70.

Also Read: What is 5G? Here is What To Expect From The Next Decade of Wireless Communication

The Helio P90 can support up to 8GB of LPDDR4x storage clocked which can be clocked up to 1866 MHz. MediaTek’s CorePilot program helps in delivering sustained peak performance with longer battery life and low operating temperature. It can support a single camera with resolution up to 48MP or a dual camera array with 24MP + 16MP resolution. It even has ultra slow-motion video capture support at 480fps.

This new chipset supports Dual 4G VoLTE making it very useful in the Indian context. On the AI front, this SoC brings in new features such as 5-person human pose tracking, Full body avatar AR, 3D pose tracking and multiple objects and scene identification. It now supports Google Lens and comes with more secure and accurate facial recognition.

MediaTek Helio P90 Vs Helio P70 Chipset: What’s Different?

Chipset Helio P90 Helio P70
Manufacturing Process TSMC 12nm FinFET production process TSMC 12nm FinFET production process
CPU 2x ARM Cortex-A75 @ 2.2GHz; 6x ARM Cortex-A55 @ 2.0GHz 4x Cortex-A73 @ 2.1 GHz
4x Cortex-A53 @ 2.0 GHz
GPU IMG PowerVR GM 9446 GPU up to 970MHz ARM Mali-G72 MP3 at up to 900MHz
RAM 2-Channel LPDDR4x up to 8GB, 1866MHz 1X LPDDR3/LPDDR4x 933MHz, 2X LPDDR4x Up to 1800MHz up to 8GB (LPDDR4x)
Camera 48MP or 24+16MP 32MP or 24MP+16MP,
Video 48MP@30FPS with ZSD or 16MP@480FPS Up to 32MP @ 30fps with ZSD or 16MP @ 90fps
Modem 4G LTE Cat-12 (DL) / Cat-13 (UL) (FDD/ TDD), 4×4 MIMO, 3CA, 256QAM, HPUE, IMS (VoLTE\ViLTE\WFC), eMBMS, Dual 4G VoLTE (DSDS), Band 71, TAS 2.0 Cat-7 DL / Cat-13 UL, 2×2 UL CA, TAS 2.0, HUPE, IMS (VoLTE\ViLTE\WoWi-Fi), eMBMS, Dual 4G VoLTE (DSDS), Band 71

 

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1 Comment
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Gurkiran
Anonymous
5 years ago

helio p90 by mediatek is really path-breaking with advanced AI technology!!

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