Earlier in the day, Huawei subsidiary HiSilicon has revealed its flagship chipset, the new Kirin 960 which helps Chinese company nudge past others SoC manufacturer on the pedestal. Huawei is likely to employ it in the upcoming Huawei Mate 9.

Also read: Oppo R9s Plus May Become World’s First Qualcomm Snapdragon 653 SoC Powered Phone

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The new chipset is made with a 16nm FinFET process by TSMC using better cores. It comes with four high-performance Cortex-A73 cores clocked at 2.4 GHz and four power saving Cortex-A53 cores ticking at 1.8 GHz in a big.LITTLE arrangement for better efficiency. The Kirin 960 is coupled with ARM’s new Bifrost GPU- the Mali-G71 MP8, which ensures better graphics with low power consumption.

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The Kirin 960 will offer much-improved speed with LTE Cat.12/13 support which would enable download speeds of up to 600 Mbps and upload speeds of 150 Mbps. It also supports LPDDR4 memory. The company says, all this enables 15% better CPU efficiency over the Kirin 950 and 180% better graphics performance.

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The Kirin 960 chipset topples Apple A10 and Qualcomm Snapdragon 821 chipsets to tops the chart in multi-core performance. However, A10 still clocks a better score on in single core benchmark test. If everything goes as per schedule, Huawei is expected to introduce Kirin 960 powered Mate on November 3 in China.

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Also read: Honor 6X with Dual Rear Cameras Officially Announced

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