After experimenting with 3nm chips, Apple is now rumored to be adopting TSMC’s next-generation 2-nanometer fabrication process for its 2026 iPhones. This shift, coupled with a new packaging method integrating 12GB of RAM, is expected to be a significant advancement.
2nm Chips on iPhone 18
This information originates from Weibo user “Phone Chip Expert,” who claims that Apple will transition to a new WMCM (Wafer-Level Multi-Chip Module) packaging method with the A20 chip in the iPhone 18 series. This change will enable Apple to incorporate a substantial 12GB RAM module within the same chip package.
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Previously, Apple and other manufacturers utilized the InFo (Integrated Fan-Out) packaging method. This method allows for component integration where the RAM is positioned close to the SoC on a single-die package, reducing the size and enhancing the performance of individual chips.
12GB RAM iPhones coming next year
Currently, all iPhone 16 models feature 8GB of RAM. Analysts like Ming-Chi Kuo anticipate the introduction of 12GB RAM with the iPhone 17 Pro models. Kuo also believes that only the “Pro” models in the iPhone 18 series will likely utilize TSMC’s next-generation 2nm processor due to its high cost.
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TSMC plans to commence 2nm chip production in late 2025, with Apple expected to be the first recipient of these advanced chips. TSMC is currently in the process of overhauling a new Fab to accomodate the production of 2nm chips.
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