The Mobile World Congress (MWC) 2024 just got better or should I say ‘smaller but better’. Micron Technology just launched its next-gen UFS 4.0 mobile solution which is 20% smaller in size than the predecessor. It measures at just 9x13mm but carries a maximum capacity of 1TB of storage giving an insane benefit over to the smartphone OEMs who want to introduce larger battery capacities on their devices with the now-freed space.
Micron’s UFS 4.0 solution is made to withstand intensive operations at up to 4,300 megabytes per second (MBps) of sequential read speed. It zooms past 4000 MBps in terms of sequential write speeds. For context, this is double that of the previous generations. With the available size and better performance, users can enjoy loading apps faster and being more productive with their phones.
Micron Technology is also behind fortifying the grounds for AI applications with 40% faster load times and smoother user experience. The tech giant is marketing its latest UFS 4.0 mobile solution as the world’s smallest UFS package. For comparison, high-end UFS 3.1/uMCP5 storage measures 11x13mm and 11.5x13mm respectively.
Micron’s UFS 4.0 solution is made on a 9x13mm footprint making it smaller than the 11x13mm package launched last June. It is made up of 232-layer 3D NAND Technology and is capable of delivering 25% better power efficiency along with better performance. It can be integrated into next-gen flagship, ultra-slim, and foldable phones thanks to the smaller size that can help smartphone makers accommodate larger batteries.
Micron has one-upped the latest UFS 4.0 solution with High-Performance Mode (HPM), a proprietary feature that prioritizes critical tasks during performance-intensive smartphone use resulting in improved speed by 25% in terms of launching multiple apps at once. The One Button Refresh (OBR) is another feature that cleans data automatically when you need top performance on your smartphone allowing the device to churn numbers in a new-like state.
Talking about availability, Micron is already shipping samples in capacities such as 256GB, 512GB, and 1TB. These chips can open avenues for smartphone OEMs to integrate not only larger batteries but also unlock AI features on their devices that require an insane amount of processing. Moreover, it can accommodate on-device AI processing which is unlike cloud processing, better in terms of security and reliability to the users.
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