Both MediaTek and Snapdragon will debut the first-ever 3nm chipsets on Android phones next year – Dimensity 9400 and Snapdragon 8 Gen 4, respectively. With that being said, MediaTek’s implementation is speculated to outdo Qualcomm’s as it will be using only performance cores with improved thermals.
The Dimensity 9400 application processor (AP) is expected to not have any 4x Cortex-X5 cores. Instead, the speculative configuration suggests 3x Prime Cortex-X5 cores plus 5x Cortex Performance cores made on TSMC’s N3E fabrication process.
Using an improved generation of fabrication process ensures better performance and battery efficiency. It will also improve on the thermals that were majorly a concern on this year’s flagship Dimensity 9300 SoC which reportedly failed the stress test throttling the same by 46% in just two minutes into the test. However, the chipmaker has claimed these tests were flawed.
Interestingly, tipster Digital Chat Station (DCS) claims that this configuration will give Dimensity 9400 AP an edge over Qualcomm’s Snapdragon 8 Gen 4, also debuting next year.
Do note that reports are suggesting Qualcomm’s move to remove any high-efficiency cores and instead, use only performance cores on the Snapdragon 8 Gen 4 SoC. The chipmakers are expected to use custom Oryon cores instead of ARM’s Cortex cores so it remains to be seen how these cores compare against Dimensity 9400.
A Qualcomm executive earlier mentioned that the Snapdragon 8 Gen 4 will be a tad bit more expensive than its predecessors. This should work in MediaTek’s favor as well since it will have more Chinese takers since these brands operate on slim margins and buying an expensive chipset would eat into their profits.
It’s no secret that MediaTek has been running behind Qualcomm all three ways but the next-gen chipset could give the former an edge. However, we will have to wait for the launches since Dimensity 9400 SoC is expected to launch in Q4 2024 and the same goes for Snapdragon 8 Gen 4 SoC.