MediaTek announced its new Diemsity 800U chipset to strengthen its position in the affordable 5G smartphones segment. The company seems to be fixing shortcomings of the Dimesity 800 SoC with the upgraded Dimensity 800U chipset.

The 7nm nod process-based MediaTek Dimensity 800U is the sixth 5G chipset with an integrated modem from the Taiwanese SoC maker. Other major highlights of the Dimnesity 800U chipset includes Global 5G NR support, 5G+5G Dual Sim Dual Standby (DSDS) technology, and more. The new chipset is likely to tempt OEMs for their mid-tier 5G smartphones in the coming months.

MediaTek Dimensity 800U Features

  1. The CPU architecture is manufactured using TSMC’s 7nm FinFET process. It is based on a dual-cluster design where MediaTek uses 2 ARM performance-centric Cortex A76 CPUs with efficiency-based 6 ARM Cortex A-55 CPUs.
  2. The performance cores used in Dimensity 800U tick at 2.4 GHz whereas efficiency cores are clocked at 2.0 GHz.
  3. It features the same Arm Mali-G57 GPU as its predecessor.
  4. The Dimensity 800U delivers up to 11%
    performance improvement in CPU and 28% in GPU over the Dimensity 700 series.
  5. Further, there’s an independent AI processing unit (APU).
  6. The chipset supports LPDDR4X RAM (up to 2133MHz), and supports UFS 2.2-class storage.
  7. The ISP in Dimensity 800U enables HDR-ISP, Multi-Frame NR, 3D Noise Reduction, Depth Engine, Warping Engine, AI-FD camera features.
  8. Camera capabilities see a noticeable improvement. The Dimensity 800U supports 20MP+16MP and 64MP sensors. You can expect Dimensity 800U based phones with 64MP cameras in the near future.
  9. MediaTek Dimensity 800U supports NVAIC – an Indian navigation system.
  10. The Dimensity 800U chipset is capaible of running 120Hz FHD+ screen.

MediaTek Demensity 800U could very well be the first MediaTek 5G chipset to be used in 5G phones in India. Otherwise, it wouldn’t have made sense for MediaTek to include NAVIC in a budget SoC.

SoC Qualcomm Snapdragon 768G Qualcomm Snapdragon 765/ Snapdragon 765G MediaTek Dimensity 800U
CPU 1x Cortex A76 @ 2.8GHz;1x Cortex-A76 @ 2.4GHz;
6x Cortex-A55 @ 1.8GHz
1x Cortex A76 @ 2.3GHz (in SD765) / 1X Cortex A76@ 2.4GHz (765G);
1x Cortex-A76 @ 2.2GHz;6x Cortex-A55 @ 1.8GHz
2x Cortex-A76 @ 2.4GHz;
6x Cortex-A55 @ 2.0GHz
GPU Adreno 620 ( +15% perf over 765G) Adreno 620 Mali-G57 MC3 GPU
DSP / NPU Hexagon 696, HVX+ Tensor 5.4TOPS AI (Total CPU+GPU+HVX+Tensor) Hexagon 696, HVX+ Tensor 5.4TOPS AI (Total CPU+GPU+HVX+Tensor) 3rd gen APU (details unknown)
Memory Controller 2x 16-bit CH @ 2133MHz LPDDR4X / 17.0GB/s 2x 16-bit CH @ 2133MHz LPDDR4X / 17.0GB/s 2x 16-bit CH @ 2133MHz LPDDR4X up to 12GB
ISP/Camera Dual 14-bit Spectr 355 ISP; 1x 192MP or 36MP with ZSL or 2x 22MP with ZSL Dual 14-bit Spectr 355 IS;, 1x 192MP or 36MP with ZSL or 2x 22MP with ZSL Dual ISP; 1x 64MP with ZSL or  2x 20MP + 16MP
Video Encode/ Decode 2160p30, 1080p120 H.264 & H.265; 10-bit HDR pipelines 2160p30, 1080p120 H.264 & H.265; 10-bit HDR pipelines 2160p30, 1080p120 H.264 & H.265
Integrated Modem Snapdragon X52 Integrated
LTE Category 24/22
DL = 1200 Mbps – 4x20MHz CA, 256-QAM
UL = 210 Mbps – 2x20MHz CA, 256-QAM
(5G NR Sub-6 4×4 100MHz + mmWave 2×2 400MHz)
DL = 3.7Gbps
UL = 1.6Gbps
Snapdragon X52 Integrated
LTE Category 24/22
DL = 1200 Mbps – 4x20MHz CA, 256-QAM
UL = 210 Mbps – 2x20MHz CA, 256-QAM
(5G NR Sub-6 4×4 100MHz + mmWave 2×2 400MHz)
DL = 3.7Gbps
UL = 1.6Gbps
5G Sub-6 Integrated Modem
DL = 2.3Gbps (200MHz 2CA, 256-QAM, 4×4 MIMO)
Manufacturing Process Samsung 7nm EU (7LPP) Samsung 7nm EU (7LPP) TCMC 11nm FinFIT

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