MediaTek Dimensity 800U SoC announced; Likely to ship in upcoming midrange 5G smartphones

Main Image
  • Like
  • Comment
  • Share

MediaTek announced its new Dimensity 800U chipset to strengthen its position in the affordable 5G smartphones segment. The company seems to be fixing shortcomings of the Dimesity 800 SoC with the upgraded Dimensity 800U chipset.

The 7nm node process-based MediaTek Dimensity 800U is the sixth 5G chipset with an integrated modem from the Taiwanese SoC maker. Other major highlights of the Dimnesity 800U chipset includes Global 5G NR support, 5G+5G Dual Sim Dual Standby (DSDS) technology, and more. The new chipset is likely to tempt OEMs for their mid-tier 5G smartphones in the coming months.

MediaTek Dimensity 800U Features

  1. The CPU architecture is manufactured using TSMC’s 7nm FinFET process. It is based on a dual-cluster design where MediaTek uses 2 ARM performance-centric Cortex A76 CPUs with efficiency-based 6 ARM Cortex A-55 CPUs.
  2. The performance cores used in Dimensity 800U tick at 2.4 GHz whereas efficiency cores are clocked at 2.0 GHz.
  3. It features the same Arm Mali-G57 GPU as its predecessor.
  4. The Dimensity 800U delivers up to 11%
    performance improvement in CPU and 28% in GPU over the Dimensity 700 series.
  5. Further, there’s an independent AI processing unit (APU).
  6. The chipset supports LPDDR4X RAM (up to 2133MHz), and supports UFS 2.2-class storage.
  7. The ISP in Dimensity 800U enables HDR-ISP, Multi-Frame NR, 3D Noise Reduction, Depth Engine, Warping Engine, AI-FD camera features.
  8. Camera capabilities see a noticeable improvement. The Dimensity 800U supports 20MP+16MP and 64MP sensors. You can expect Dimensity 800U based phones with 64MP cameras in the near future.
  9. MediaTek Dimensity 800U supports NAVIC – an Indian navigation system.
  10. The Dimensity 800U chipset is capaible of running 120Hz FHD+ screen.

MediaTek Demensity 800U could very well be the first MediaTek 5G chipset to be used in 5G phones in India. Otherwise, it wouldn’t have made sense for MediaTek to include NAVIC in a budget SoC.

SoC Qualcomm Snapdragon 768G Qualcomm Snapdragon 765/ Snapdragon 765G MediaTek Dimensity 800U
CPU 1x Cortex A76 @ 2.8GHz;1x Cortex-A76 @ 2.4GHz;
6x Cortex-A55 @ 1.8GHz
1x Cortex A76 @ 2.3GHz (in SD765) / 1X Cortex A76@ 2.4GHz (765G);
1x Cortex-A76 @ 2.2GHz;6x Cortex-A55 @ 1.8GHz
2x Cortex-A76 @ 2.4GHz;
6x Cortex-A55 @ 2.0GHz
GPU Adreno 620 ( +15% perf over 765G) Adreno 620 Mali-G57 MC3 GPU
DSP / NPU Hexagon 696, HVX+ Tensor 5.4TOPS AI (Total CPU+GPU+HVX+Tensor) Hexagon 696, HVX+ Tensor 5.4TOPS AI (Total CPU+GPU+HVX+Tensor) 3rd gen APU (details unknown)
Memory Controller 2x 16-bit CH @ 2133MHz LPDDR4X / 17.0GB/s 2x 16-bit CH @ 2133MHz LPDDR4X / 17.0GB/s 2x 16-bit CH @ 2133MHz LPDDR4X up to 12GB
ISP/Camera Dual 14-bit Spectr 355 ISP; 1x 192MP or 36MP with ZSL or 2x 22MP with ZSL Dual 14-bit Spectr 355 IS;, 1x 192MP or 36MP with ZSL or 2x 22MP with ZSL Dual ISP; 1x 64MP with ZSL or  2x 20MP + 16MP
Video Encode/ Decode 2160p30, 1080p120 H.264 & H.265; 10-bit HDR pipelines 2160p30, 1080p120 H.264 & H.265; 10-bit HDR pipelines 2160p30, 1080p120 H.264 & H.265
Integrated Modem Snapdragon X52 Integrated
LTE Category 24/22
DL = 1200 Mbps – 4x20MHz CA, 256-QAM
UL = 210 Mbps – 2x20MHz CA, 256-QAM
(5G NR Sub-6 4×4 100MHz + mmWave 2×2 400MHz)
DL = 3.7Gbps
UL = 1.6Gbps
Snapdragon X52 Integrated
LTE Category 24/22
DL = 1200 Mbps – 4x20MHz CA, 256-QAM
UL = 210 Mbps – 2x20MHz CA, 256-QAM
(5G NR Sub-6 4×4 100MHz + mmWave 2×2 400MHz)
DL = 3.7Gbps
UL = 1.6Gbps
5G Sub-6 Integrated Modem
DL = 2.3Gbps (200MHz 2CA, 256-QAM, 4×4 MIMO)
Manufacturing Process Samsung 7nm EU (7LPP) Samsung 7nm EU (7LPP) TCMC 11nm FinFIT
Smartprix StaffSmartprix Staff
The SM Staff team consists of tech-savvy writers and editors adept at simplifying complex tech into easily understandable information.



Related Articles

ImageExclusive: Samsung Galaxy Z Flip 6 Specs Revealed Ahead of Unveiling at Paris Unpacked

Samsung’s upcoming Galaxy Unpacked event is scheduled for July 10, which is still several weeks away. At the upcoming unpacked event, Samsung is set to announce the Galaxy Z Flip 6, Galaxy Z Fold 6, Galaxy Watch 7, Galaxy Watch Ultra, and Galaxy Ring. Earlier, we revealed the 5K renders of the Galaxy Z Flip6 …

ImageRealme 7 5G with Mediatek Dimensity 800U Goes Official

Realme 7 5G has debuted in the UK. Upfront, there’s a punch-hole display, a side-mounted fingerprint sensor, and a 48MP quad-camera setup at the back. Inside, the phone bears a Mediatek Dimensity 800U chipset and a 5000mAh battery. Here are the price, availability, and a quick look at the specs — Realme 7 5G Price …

ImageMediaTek Dimensity 1200 5G arrives in India; Will be equipped within a Realme flagship

MediaTek has formally brought its latest flagship processor Dimensity 1200 5G chipset to India. The announcement has been made during the 8th MediaTek Technology Diaries event held on April 20 virtually. Sharing the stage, Realme also made it official that they will be the first brand to unveil a smartphone with this platform. MediaTek had …

ImageMediaTek Dimensity 6300 SoC Debuts With 2.4 GHz Max Clock Speed And Improved 5G Performance

The Taiwan-based chip manufacturing company MediaTek has released a new entry-level smartphone chipset – the Dimensity 6300 SoC. Announced on April 19, 2024, the chipset offers 10 percent faster CPU performance than its predecessor and over 50 percent “GPU performance advantage versus competitor alternative platforms.” MediaTek Dimensity 6300 Availability Per some reports, the upcoming Realme …

ImageMediaTek to launch Dimensity 9300+ SoC on May 7: Details Inside

Leading chipmaker MediaTek has confirmed that it will launch the next in the 9300 series on May 7. MediaTek Dimensity 9300+ SoC will be announced next week which is the successor to the MediaTek Dimensity 9300 that was announced earlier. Alongside the chipset, the chipset manufacturing giant will also reveal its AI Strategy and Vision …

Discuss

1 Comment
User
Pallav
Anonymous
3 years ago

heard recently that the Redmi Note 9 series is expanding to 5G and it might have the mediatek dimensity 800U chip, which will be quite an upgrade to the smartphone

Reply