Taiwanese SoC giant MediaTek has launched its first 5G chipset in the form of Dimensity 1050. It is the first by the company to offer dual mmWave and sub-6GHz 5G connectivity. Alongside the Dimensity 1050 chipset, MediaTek has also launched Dimensity 930 and Helio G99 chipsets. The new chipsets will be available for consumers in the 2nd quarter of 2022.
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MediaTek Dimensity 1050 Chipset
Dimensity 1050 is a toned-down version of the Dimensity 1100 chipset. It has an eight-core setup including 6 Arm Cortex A55 efficiency cores and 2 Arm Cortex A55 efficiency cores and 2 Arm Cortex A78 high-performance cores. It is paired with an Arm Mali-G71 GPU and MediaTek HyperEngine 5.0. The chipset is based on a 6nm fabrication process and supports an FHD+ display and 144Hz refresh rate.
The newest 5G chipset will have support for hardware accelerated AV1 video decoding, HDR10+ playback, and Dolby Vision on board. It will also support connectivity between mmWave and sub-6GHz 5G along with Bluetooth 5, Wi-Fi 6E with 2x2MIMO antenna, 4CC/3CC carrier integration, and more.
In terms of camera support, Dimensity 1050 has a MediaTek Imagiq 760 ISP which can support up to 108MP primary camera with a dual HDR Video capture engine.
MediaTek Dimensity 930
This one is an upgraded version of the existing Dimensity 810 SoC. It will enable 5G phones to download faster and stay connected regardless of location with 2CC-CA, including mixed duplex FDD+TDD for higher speeds and greater reach. The chipset is equipped with MiraVision HDR video playback and display for 120Hz FullHD+ displays and HDR10+ video. HyperEngine 3.0 Lite gaming enhancements will also give lower latency for smoother experiences.
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Helio G99
The MediaTek Helio G99 will power mobile gaming experiences on 4G/LTE for higher throughput rates and better power efficiency compared to the G96.
