MediaTek Dimensity 820 Announced: Will compete against Snapdragon 765G and 768G

MediaTek has announced Dimensity 820, a 7nm process based 5G chipset for affordable flagships that will compete against the likes of Huawei Kirin 820 and Qualcomm Snapdragon 768G.

According to MediaTek, the Dimensity 820 will deliver 37% better multi-core performance than rivals and will make 5G more accessible to masses.

Mediatek Dimensity 820 Features

MediaTek Dimensity 820 has a powerful CPU configuration. The four Cortex-A76 performance cores are clocked at 2.6GHz and the other four Cortex-A55 power cores at up to 2.0GHz. For graphics, there is 5-core Mali-G57 GPU with HyperEngine 2.0 and MediaTek claims 33% performance improvement over rivals.

Phones employing the chipset can have up to Full HD+ resolution displays (2520 x 1080) with 120Hz display refresh rate and HDR10+ support. MediaTek also MiraVision Video that optimizes display settings and video streams in order to enhance playback experience.

Camera capabilities include support for up to 80MP single cameras, 32MP + 16MP dual cameras, and multi-frame 4k HDR recording. The SoC further integrates APU 3.0 machine learning technology that’ll assist AI-driven image and video processing on MediaTek Dimensity 820 phones.

The chipset has dual-SIM dual Standby support for dual-mode Sub-6GHz 5G (not mmWave). MediaTek provides 2CC carrier aggregation and assures of faster average 5G speeds and better handover between different 5G networks as compared to competitors.

Other connectivity options include Bluetooth 5.1, Wi-Fi 5 (a/b/g/n/ac) and FM radio.

MediaTek Dimensitry 820 Phones

Phones with MediaTek Dimensity 820 will start shipping in the second half of 2020.

Xiaomi Redmi 10X Series

Xiaomi has confirmed on Weibo that its upcoming Redmi 10X series will be a light flagship powered by Dimensity 820. This should be the first phone to debut with the chipset.

MediaTek Dimensity 820 FAQ